Magnetron sputtering

We offer magnetron sputtering for applications including semiconductor electronics, photovoltaics, optoelectronics. The PVD system is ideal for both single processes for research and development and small production runs on substrates of both standard and non-standard dimensions up to 200 mm in diameter.

The system allows up to four materials to be sprayed sequentially without removing the sample from the vacuum chamber and coming into contact with air. Two sputtering modes (RF and DC) allow dielectric and metal layers to be produced, while reactive sputtering in a nitrogen and oxygen atmosphere is also possible.

Process conditions:

  • possibility to perform the process on substrates with a diameter of up to 200 mm (smaller pieces as well as small pieces are also possible)
  • deposition of Al, Ti, Cr, Mo metal layers and AlN, TiO2 , Al2 O3 , TiN, AlOx Ny , TiOx Ny and other dielectrics (other materials possible by prior arrangement)
  • layer thicknesses from a few nanometers to approximately 1 μm, magnetrons allowing DC, RF and pulsed DC operation

Keywords: sputtering, magnetron sputtering, pvd system, sequential sputtering, rfsputtering, dc sputtering, pulsed dc


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