Field / Discipline

  • Engineering and technical sciences – automation, electronics and electrical engineering 
  • Exact and natural sciences – physical sciences 
  • Exact and natural sciences – chemical sciences

Research infrastructure

Selected services are offered along with the available equipment and for use in the work of our partners: 

  1. High resolution scanning electron microscope (HR-SEM) Auriga 60 from Carl Zeiss with resolution <2.0nm@1kV, <1.0nm@15kV, magnification from 20x to 2 000 000x
  2. Optical microscope Axio from Carl Zeiss (magnification from 1.25x to 1 500x)
  3. Spectroscopic ellipsometer UVISEL-2 from Horiba Jobin Yvon (spectral range: 190nm – 2100nm) with 2D mapping capability, for determining thickness and optical parameters of thin films
  4. Wafer bonding system EVG510/200 from EVGroup (EVG) for bonding of substrates
  5. Mask aligner for photolithography processes EVG6200NT/200/TB from EVGroup (EVG) used for patterning
  6. Spin|Step SpinMask 300 system from AP&S for mask cleaning and chemical processing on single wafers
  7. Semi-automatic resist processing system EVG101 from EVGroup (EVG) for resist spin coating and development after exposure
  8. Dry etching system in chlorine or fluorine plasma enhanced by reactive ions (RIE – Reactive Ion Etching) PlasmaPro 100 ICP (Inductively Coupled Plasma) from Oxford Instruments
  9. Magnetron sputtering system PlasmaPro 400 from Oxford Instruments for layer deposition
  10. PECVD (Plasma Enhanced Chemical Vapour Deposition) system PlasmaPro 100 from Oxford Instruments used for deposition of layers: silicon oxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiNx), amorphous silicon (a-Si) with possibility for control of composition and mechanical strain
  11. Ion implanter FLEXion 200 from IBS for ion implantation into substrates with possibility of heating up to 500°C
  12. Batch spray systems from Siconnex for automatic etching of layers and chemical cleaning of substrates with multistage standard cleaning process
  13. Electron beam lithography tool JBX-9300FX from Jeol for fabrication of nanometric scale patterns on substrate, used for fabrication of precise patterns as well as fabrication of photomasks
  14. Two stacks of horizontal furnaces for medium and high temperature processing from Termco and LPCVD (Low Pressure Chemical Vapour Deposition) for annealing, oxidation and diffusion of silicon substrates as well as deposition of polysilicon and silicon nitride (SixNy) layers
  15. Direct contact hotplates from Sawatec for controlled treatment of resists
  16. Rapid Thermal Processing (RTP) furnace for processing at temperature up to 1450°C, with max. ramp of 200°C/s


  1. Planar Technologies Team
  2. Integrated Photonics Team
  3. Optical Structures Technology Team
  4. The Internet of Things Team
  5. Energy Harvesting Team

Selected Projects and collaboration

  1. PRIME – Ultra-Low PoweR technologIes and Memory architectures for IoT (IoT, PRIME Horyzont 2020, 2015-2019)
  2. MIRPIC – Photonics Integrated Circuits technologies for MIDIR (TECHMATSTRATEG, 2021-2023)
  3. FOTECH-1 – Electrically-driven waveguiding systems in LC:PDMS structures (FOTECH-1, 2020)
  4. NCN PRELUDIUM – Study of the interband tunneling phenomenon between low dimensional carrier gases in tunnel field-effect transistor (NCN, PRELUDIUM, 2019-2022)
  5. AREP – Autonomous system for digital space and investment surveillance using UAVs and mobile docking stations – the scope of responsibility covers the development, construction and testing of control and communication module U2U, U2I providing communication between drones, and between drones and ground station (subcontract, 2020-2021)

CEZAMAT cooperates closely with CENTREA – the Centre for Terahertz Technology Research and Application (Institute of High Pressure Physics of the Polish Academy of Sciences) in the field of terahertz technology. The collaboration includes research on the fundamental properties and application of terahertz radiation.

The R&D includes a range of research and technology services. The simplest model of the services offered is to optimise the execution of single processes with the use of unique instrumentation. The model of cooperation with SEMISYS that is most often chosen by industrial and research partners includes the development of functional systems from the design stage to the achievement of the target geometry of the structures meeting the required functionality. This means that the team performs a wide range of activities related to the development of special-purpose integrated circuits. We respond to the needs of industrial partners by providing support for the development cycle from the definition of the functional requirements to the delivery of a pilot series, along with technical documentation that enables mass production. The individual services, including single processes and process cycles, involves characterisation and optimisation of layer manufacturing at the set angle, shape mapping and execution, including optimisation of a complex sequence of technological processes.

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