Mask aligner

EVG6200NT /200/TB mask aligner by EVGroup (EVG) for contact and proximity exposure.

Technical specification

  • Substrate size from pieces, up to 200mm (round)
  • Photomask size from 2,5”x2,5” to 9”x9”, thickness <7mm
  • Top Side Alignment (TSA) and Back Side Alignment (BSA)
  • Exposure in spectral lines at 436 nm (“g-line”), 405 nm (“h-line”) and 365 nm (“i-line”)
  • Exposure modes: proximity, soft contact, hard contact, vacuum contact
  • Wafer alignment for wafer bonding process

Application

  • Fabrication pattern in resist through photomask
  • Wafer alignment for wafer bonding process

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