PlasmaPro 400 magnetron sputtering tool is an efficient and versatile system that can be used in many fields: semiconductor electronics, photonics, photovoltaics.
- Vacuum loadlock for high throughput
- Compatible with all wafer sizes up to 200 mm
- Loading capacity of 4 wafers
- DC magnetron sputtering for metals, pulsed DC for high rate, rf magnetron for dielectrics
- Reactive sputtering adding O2, N2, H2
- Deposition of metals (Al, Ti) and dielectrics (AlN, TiO2, Al2O3, TiN)
- Deposition of oxy-nitrides (TiOxNy)